ASU gets $1.2B for semiconductor research, development
Independent Newsmedia/Brent Ruffner
A look at the TSMC Arizona campus. On Thursday, the U.S. Department of Commerce announced ASU will receive two funding awards — $1.1 billion “to operate and manage” an advanced packaging piloting facility in Tempe and another $100 million to go toward “innovation in the domestic microchip packaging ecosystem” to help advance the industry.
The packaging pilot facility will be within the ASU Research Park in Tempe, near Loop 101 and Elliot Road.
Arizona State University is continuing to be a major player in helping advance the microchip industry.
On Thursday, the U.S. Department of Commerce made a funding announcement that helps back that up.
The U.S. Department of Commerce announced ASU will receive two funding awards — $1.1 billion “to operate and manage” an advanced packaging piloting facility in Tempe and another $100 million to go toward “innovation in the domestic microchip packaging ecosystem” to help advance the industry.
The packaging pilot facility will be within the ASU Research Park in Tempe, near Loop 101 and Elliot Road.
Research and development for advanced semiconductor packaging should help lure startup businesses to the region and people who want to jump on board to make chips the best in the world, said Jay Thorne, associate vice president of media relations and strategic communications at ASU.
The U.S. Department of Commerce announcement said it finalized “$1.4 billion in award funding” to “bolster U.S. leadership in advanced packaging and enable new technologies to be validated” and transitioned at scale to U.S. manufacturing, according to a press release.
The ultimate goal is to design chips that allow devices such iPhones and computers to become faster and not overheat, Thorne said.
Other awardees include: Absolics Inc. in Covington, Georgia; Applied Materials Inc. in Santa Clara, California.
A portion of the ASU funding relates to the SHIELD USA initiative, which looks to advance “the microchip packaging ecosystem, expand capacity for domestic advanced packaging and help regain U.S. leadership in microelectronics while” strengthening national security, a press release stated.
“This is just becoming the place where you want to be if you are interested in this work,” Thorne said.
Brent Ruffner joined Independent Newsmedia, Inc., USA, in 2021 where he writes about developments at TSMC and Maricopa County issues, including election topics.
He's written about stories that range from accusations that a Mesa monkey breeding facility is unsafe to what to do if you encounter a rattlesnake in the desert.
Community: He is a supporter of the American Cancer Society.
Education: Bachelor's degree in Journalism and Mass Communication, Arizona State University, May 2007.
Random Fact: He met former San Francisco Giants outfielder Willie Mays at a Phoenix Firebird game after winning a contest for an autographed baseball.
Hobbies: Hiking in the woods and collecting sports memorabilia.
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