Taiwan Semiconductor Manufacturing Co. announced a $100 billion investment in Arizona during its second quarter earnings call Thursday morning.
The investment will build several more semiconductor logic wafer fabs for 2 nanometer and below technologies, as well as advanced packaging fabs, to support the strong multi-year demand from leading U.S. customers.
“We believe this investment will help to further foster the development of the U.S. semiconductor ecosystem, strengthen the supply chain, and support an increasing number of high-tech, high-paying jobs in the United States,” said Chairman and CEO of TSMC C.C. Wei on the earnings call.
