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BUSINESS

Amkor, TSMC sign agreement to bring chip packaging into Peoria

Amkor Technology and Taiwan Semiconductor Manufacturing Co. have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, continuing to pave the path for a microchip supply chain running through Peoria.

While an MOU is not legally binding, it outlines the companies’ intentions of working together.

Deputy City Manager Mike Faust said the MOU is great news that supports Peoria’s economic development strategy of growing the target markets of semiconductor and microelectronics.

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